We offer sideplating for the outer edges of your circuit boards. We kindly ask you to follow the design parameters to ensure flawless production:
In your layout data, the circuit board edge to be sideplated must be marked with 500µm of protruding copper. A connection of at least 300µm must also be defined.
Layers that are not to be connected should have a clearance of at least 800µm on the outer contour.